hisense A9 Pro vs Ulefone Armor 22

Übersicht

Marke: HiSense; Ulefone
Erscheinungsdatum: März 2023, vor 3 Jahren und 3 Monaten; August 2023, vor 2 Jahren und 10 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 302.000 Antutu v9 Overall performance better than 61% of devices

Größe: 6.1"; 6.58"
Auflösung: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 401 ppi Very high density
Seitenverhältnis: 18:9; 20:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Capacitive, Multi-touch, Oleophobic coating

Chipsatz: Qualcomm Snapdragon 662; MediaTek Helio G96
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 12 nm
Taktfrequenz: 2 GHz; 2.05 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57 MC2 900MHz
Arbeitsspeicher: 8 GB; 8 GB
64-Bit: Yes; Yes
RAM-Typ: —; LPDDR4X RAM

Auflösung: 13 Mpx; 64 Mpx
Blende: Unknow; ƒ/ 1.89
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode, Night Vision
Sensor: —; Sony IMX686 Exmor RS
Pixelgröße: —; 0.80 µm
Sensorgröße: —; 1/1.7"

Kapazität: 256 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.1

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.9 mm 176.8 mm 15.0 mm Print 3D Model
Gewicht: 183 g; 324 g
Materialien: Plastic; Rugged Smartphone, Polycarbonate
Farben: Black; Black Green
Nutzbare Fläche: 76 %; 69 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)