hisense A9 Pro vs iiif150 B1

hisense
A9 Pro

iiif150
B1
Übersicht
- Marke
- HiSense
- iiiF150
- Erscheinungsdatum
- März 2023, vor 3 Jahren und 3 Monaten
- August 2022, vor 3 Jahren und 10 Monaten
- AnTuTu
- 102.000 Antutu v9 Overall performance better than 51% of devices
- 160.000 Antutu v10 Overall performance better than 54% of devices
Display
- Größe
- 6.1"
- 6.5"
- Auflösung
- 824 x 1648 px FHD
- 1080 x 2400 px FHD+
- Typ
- eInk E INK Carta 1200
- LCD IPS
- Pixeldichte
- 302 ppi High Density
- 405 ppi Very high density
- Seitenverhältnis
- 18:9
- 20:9
- Funktionen
- Water Drop Notch, Capacitive, Multi-touch, Frameless
- Hole-punch Notch, Corning Gorilla Glass, Capacitive, Multi-touch
Leistung
- Chipsatz
- Qualcomm Snapdragon 662
- MediaTek Helio G37
- CPU
- 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
- 8x2.3GHz Cortex A53
- CPU-Typ
- Octa-Core
- Octa-Core
- Fertigung
- 11 nm
- 12 nm
- Taktfrequenz
- 2 GHz
- 2.3 GHz
- GPU
- Qualcomm Adreno 610
- PowerVR GE832
- Arbeitsspeicher
- 8 GB
- 6 GB
- 64-Bit
- Yes
- Yes
- RAM-Typ
- —
- LPDDR4X RAM
Hauptkamera
- Auflösung
- 13 Mpx
- 20 Mpx
- Blende
- Unknow
- Unknow
- Blitz
- LED
- Triple LED
- Optische Stabilisierung
- No
- No
- Zeitlupe
- No, 30 fps
- No, 30 fps
- Funktionen
- Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
- Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Frontkamera
- Auflösung
- 5 Mpx
- 16 Mpx
- Blende
- ƒ/ 2.0
- ƒ/ 2.8
- Sensor
- —
- Samsung S5K3P9
- Pixelgröße
- —
- 1.00 µm
Akku
- Kapazität
- 4000 mAh
- 10000 mAh
- Typ
- Li-Ion
- Li-Polymer
- Schnellladung
- No
- Yes , 18.0W
- Funktionen
- Non-removable
- Non-removable
Speicher
- Kapazität
- 256 GB
- 64 GB
- SD-Slot
- Yes , Slot for SD or second SIM card
- Yes , Slot for SD or second SIM card
Gehäuse
- Abmessungen
- 79.5 mm 159.0 mm 7.8 mm Print 3D Model
- 81.6 mm 171.0 mm 16.7 mm Print 3D Model
- Gewicht
- 183 g
- 356 g
- Materialien
- Plastic
- Rugged Smartphone, Plastic , Magnesium alloy
- Farben
- Black
- —
- Nutzbare Fläche
- 76 %
- 73 %
- Wasser-/Staubschutz
- —
- IP68, MIL-STD-810G , IP69
Software
- Betriebssystem
- Android 12 Snow Cone Android 12
- Android 12 Snow Cone Android 12
- Google-Dienste
- With Google Mobile Services
- With Google Mobile Services
Konnektivität
- SIM
- Dual SIM Dual Standby (Nano SIM + Nano SIM)
- Dual SIM Dual Standby (Nano SIM + Nano SIM)
- Bluetooth
- Bluetooth 5.1
- Bluetooth 5.0
- Bluetooth-Profile
- A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
- A2DP (Advanced Audio Distribution Profile)
- Wi-Fi
- 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
- 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
- Wi-Fi-Funktionen
- Dual band, Wi-Fi Hotspot
- Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
- USB
- USB Type-C
- USB Type-C
- USB-Funktionen
- Charging, OTG
- Charging, OTG
- Navigation
- GPS, A-GPS
- GPS, A-GPS, GLONASS, Beidou, Galileo
Netzwerke
- 4G LTE
- B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
- B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
- 3G
- B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
- B1 (2100), B8 (900)
- 2G
- B2 (1900), B3 (1800), B5 (850), B8 (900)
- B2 (1900), B3 (1800), B5 (850), B8 (900)
Sensoren & Sicherheit
- Fingerabdruck
- Yes, on the side
- Yes, on the side
- Beschleunigungssensor
- Yes
- Yes
- Näherungssensor
- Yes
- Yes
- Lichtsensor
- Yes
- Yes
- Kühlsystem
- No
- No
- Audio
- Stereo Speakers
- —
- Gyroskop
- —
- Yes















