Infinix Hot 30 Play vs Meizu mblu 21

Infinix Hot 30 Play
Infinix
Hot 30 Play
Meizu mblu 21
Meizu
mblu 21

Übersicht

Marke
Infinix
Meizu
Erscheinungsdatum
April 2023, vor 3 Jahren und 2 Monaten
November 2024, vor 1 Jahren und 7 Monaten
AnTuTu
135.000 Antutu v9 Overall performance better than 53% of devices
239.300 Antutu v10 Overall performance better than 57% of devices

Display

Größe
6.82"
6.79"
Auflösung
720 x 1640 px HD+
720 x 1640 px HD+
Typ
LCD IPS
LCD IPS
Pixeldichte
263 ppi Medium Density
264 ppi Medium Density
Seitenverhältnis
21:9
20:9
Funktionen
Hole-punch Notch, Refresh rate 90 Hz, Touch sampling rate 180 Hz, Peak brightness - 500 cd/m², 1500:1 contrast ratio, 86% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch
Hole-punch Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Leistung

Chipsatz
MediaTek Helio G37
Unisoc Tiger T606
CPU
8x2.3GHz Cortex A53
2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU-Typ
Octa-Core
Octa-Core
Fertigung
12 nm
12 nm
Taktfrequenz
2.3 GHz
1.6 GHz
GPU
PowerVR GE832
ARM Mali-G57
Arbeitsspeicher
4 GB
4 GB
RAM-Typ
LPDDR4X RAM
64-Bit
Yes
Yes

Hauptkamera

Auflösung
16 Mpx
13 Mpx
Blende
ƒ/ 1.8
Unknow
Blitz
LED
LED
Optische Stabilisierung
No
No
Zeitlupe
No, 30 fps
No, 30 fps
Funktionen
Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Pixelgröße
0.80 µm

Frontkamera

Auflösung
8 Mpx
8 Mpx
Blende
ƒ/ 2.0
ƒ/ 2.0
Sensor
Hynix HI-846
Pixelgröße
1.12 µm

Akku

Kapazität
6000 mAh
4900 mAh
Typ
Li-Polymer
Li-Polymer
Schnellladung
Yes , 18.0W
Yes , 18.0W
Funktionen
Non-removable
Non-removable

Speicher

Kapazität
128 GB
64 GB
SD-Slot
Yes , Slot for SD or second SIM card
No

Gehäuse

Abmessungen
77.5 mm 170.6 mm 8.7 mm Print 3D Model
78.0 mm 170.8 mm 9.4 mm Print 3D Model
Gewicht
205 g
196 g
Materialien
Plastic
Plastic
Farben
Black White Purple
Black White Blue
Nutzbare Fläche
83 %
82 %

Software

Betriebssystem
Android 13 Tiramisu XOS 12.6 (Android 13)
Android 14 Upside-down cake Android 14
Google-Dienste
With Google Mobile Services
With Google Mobile Services

Konnektivität

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.0 LELow energy consumption
Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB-Funktionen
Charging, OTG
Charging, OTG
Navigation
GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo
GPS, A-GPS, GLONASS, Beidou, Galileo

Netzwerke

4G LTE
B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
B1 (2100), B3 (1800), B5 (850), B7 (2600), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
B1 (2100), B5 (850)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B2 (1900), B3 (1800), B5 (850)

Sensoren & Sicherheit

Fingerabdruck
Yes, on the side
Yes, on the side
Beschleunigungssensor
Yes
Yes
Gyroskop
Yes
Näherungssensor
Yes
Yes
Lichtsensor
Yes
Yes
Kühlsystem
Yes
No

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