hotwav T7S vs Oukitel G5

Übersicht

Marke: Hotwav; Oukitel
Erscheinungsdatum: Januar 2025, vor 1 Jahren und 4 Monaten; Juli 2025, vor 10 Monaten
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 141.000 Antutu v9 Overall performance better than 53% of devices

Größe: 6.52"; 6"
Auflösung: 1080 x 2460 px FHD+; 576 x 1152 px LowRes
Typ: LCD IPS; LCD IPS
Pixeldichte: 407 ppi Very high density; 215 ppi Medium Density
Seitenverhältnis: 21:9; 18:9
Funktionen: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Without Notch, Brightnes 450 cd/m² (typ), 1000:1 contrast ratio, Capacitive, Multi-touch

Chipsatz: MediaTek MT8788V; Unisoc Tiger T310
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 1 x ARM Cortex A75 2.0Ghz + 3 x ARM Cortex A55 1.8Ghz
CPU-Typ: Octa-Core; Quad-Core
Fertigung: 12 nm; 12 nm
Taktfrequenz: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; —
Arbeitsspeicher: 4 GB; 4 GB
RAM-Typ: LPDDR4X RAM; —
64-Bit: Yes; Yes

Auflösung: 21 Mpx; 13 Mpx
Blende: Unknow; ƒ/ 2.2
Sensor: Sony Exmor; Omnivision OV13853
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Pixelgröße: —; 1.12 µm
Sensorgröße: —; 1/3.06"

Kapazität: 128 GB; 256 GB
Typ: eMMC 5.1 Storage; eMMC 5.1 Storage
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Abmessungen: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 81.1 mm 166.0 mm 15.0 mm Print 3D Model
Gewicht: 310 g; 300 g
Materialien: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Polycarbonate
Farben: Black Green; Black Red Green
Wasser-/Staubschutz: IP68, IP69 , MIL-STD-810H; IP68
Sturzfestigkeit: Class A B C D E 270 drops without defects; Class A B C D E 45 drops without defects
Reparierbarkeit: Class A B C D E; Class A B C D E
Nutzbare Fläche: 71 %; 69 %

Betriebssystem: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)