hotwav T7S vs Oukitel C59 Pro

Übersicht

Marke: Hotwav; Oukitel
Erscheinungsdatum: Januar 2025, vor 1 Jahren und 4 Monaten; April 2025, vor 1 Jahren und 1 Monaten
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 240.000 Antutu v10 Overall performance better than 57% of devices

Größe: 6.52"; 6.88"
Auflösung: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 407 ppi Very high density; 260 ppi Medium Density
Seitenverhältnis: 21:9; 20:9
Funktionen: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Corning Gorilla Glass 5, Capacitive, Multi-touch, Frameless

Chipsatz: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 12 nm; 12 nm
Taktfrequenz: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
Arbeitsspeicher: 4 GB; 8 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 21 Mpx; 13 Mpx
Blende: Unknow; Unknow
Sensor: Sony Exmor; —
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapazität: 128 GB; 256 GB
Typ: eMMC 5.1 Storage; —
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Abmessungen: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 77.5 mm 166.0 mm 13.3 mm Print 3D Model
Gewicht: 310 g; 293 g
Materialien: Rugged Smartphone, Plastic , Faux leather; Plastic
Farben: Black Green; Black Blue Green
Wasser-/Staubschutz: IP68, IP69 , MIL-STD-810H; —
Sturzfestigkeit: Class A B C D E 270 drops without defects; Class A B C D E 180 drops without defects
Reparierbarkeit: Class A B C D E; Class A B C D E
Nutzbare Fläche: 71 %; 87 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)