hotwav T7 Pro vs realme C75

hotwav T7 Pro
hotwav
T7 Pro
realme C75
realme
C75

Übersicht

Marke
Hotwav
realme
Erscheinungsdatum
Juni 2024, vor 2 Jahren
November 2024, vor 1 Jahren und 7 Monaten
AnTuTu
241.300 Antutu v10 Overall performance better than 58% of devices
288.947 Antutu v10 Overall performance better than 61% of devices

Display

Größe
6.6"
6.72"
Auflösung
1080 x 2460 px FHD+
1080 x 2400 px FHD+
Typ
LCD IPS
LCD IPS
Pixeldichte
407 ppi Very high density
392 ppi High Density
Seitenverhältnis
21:9
20:9
Funktionen
Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch
Hole-punch Notch, 680 cd/m² HBM, Refresh rate 90 Hz, Touch sampling rate 180 Hz, Brightnes 580 cd/m² (typ), Peak brightness - 950 cd/m², 1500:1 contrast ratio, TÜV Rheinland Eye Comfort Certification, DCI-P3, 83% NTSC, Scratch resistant, 2.5D glass screen, Capacitive, Multi-touch, Frameless

Leistung

Chipsatz
MediaTek MT8788V
MediaTek Helio G92 MAX
CPU
4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
CPU-Typ
Octa-Core
Octa-Core
Fertigung
12 nm
12 nm
Taktfrequenz
2 GHz
2 GHz
GPU
Mali-G72 MP3
Arm Mali-G52 MC2
Arbeitsspeicher
6 GB
8 GB
RAM-Typ
LPDDR4X RAM
LPDDR4X RAM
64-Bit
Yes
Yes

Hauptkamera

Auflösung
64 Mpx
50 Mpx
Blende
Unknow
ƒ/ 1.75
Blitz
LED
LED
Optische Stabilisierung
No
No
Zeitlupe
No, 30 fps
No, 30 fps
Funktionen
Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Frontkamera

Auflösung
8 Mpx
8 Mpx
Blende
ƒ/ 2.0
ƒ/ 2.0

Akku

Kapazität
6280 mAh
5828 mAh
Typ
Li-Polymer
Li-Polymer
Schnellladung
Yes , 15.0W
Yes , 45.0W
Ladezyklen
1100 cycles
1600 cycles
Laufzeit
~ 46h
~ 70h
Funktionen
Reverse charging, Non-removable
Reverse charging, Non-removable

Speicher

Kapazität
256 GB
128 GB
Typ
eMMC 5.1 Storage
UFS Storage 2.1
SD-Slot
Yes , Slot for SD or second SIM card
Yes , Independent SD slot

Gehäuse

Abmessungen
82.8 mm 174.6 mm 12.8 mm Print 3D Model
76.2 mm 165.7 mm 8.0 mm Print 3D Model
Gewicht
292 g
196 g
Materialien
Rugged Smartphone, Plastic , Faux leather
Plastic
Farben
Black Orange
Black Gold
Wasser-/Staubschutz
IP68, IP69 , MIL-STD-810H
IP68, IP69 , MIL-STD-810H
Sturzfestigkeit
Class A B C D E 270 drops without defects
Class A B C D E 270 drops without defects
Reparierbarkeit
Class A B C D E
Class A B C D E
Nutzbare Fläche
71 %
86 %

Software

Betriebssystem
Android 13 Tiramisu Android 13
Android 14 Upside-down cake RealmeUI 5.0 (Android 14)
Google-Dienste
With Google Mobile Services
With Google Mobile Services
Updates
OS updates: 1 years, Security updates: 2 years

Konnektivität

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.0 LELow energy consumption
Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB Type-C
USB-Funktionen
Charging, OTG
Charging, OTG
Navigation
GPS, A-GPS, GLONASS, Beidou, Galileo
GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo

Netzwerke

4G LTE
B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
B1 (2100), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B2 (1900), B3 (1800), B5 (850), B8 (900)

Sensoren & Sicherheit

Fingerabdruck
Yes, on the side
Yes, on the side
Beschleunigungssensor
Yes
Yes
Näherungssensor
Yes
Yes
Lichtsensor
Yes
Yes
Kühlsystem
No
No
Audio
Stereo Speakers
Noise cancellation microphone
Gyroskop
Yes

Verglichen mit hotwav T7 Pro

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    T7 Pro
    6 GB · 6.6" · MediaTek MT8788V
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    T7 Pro
    6 GB · 6.6" · MediaTek MT8788V
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    T7 Pro
    6 GB · 6.6" · MediaTek MT8788V
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    6 GB · 6.6" · MediaTek MT8788V
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    6 GB · 6.6" · MediaTek MT8788V
    hotwav T7 Pro
    Blackview A85
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Verglichen mit realme C75

  • realme
    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
    realme C75
    realme Note 60x
    realme
    Note 60x
    4 GB · 6.74" · Unisoc Tiger T612 / T7225
    Vergleich öffnen
  • realme
    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
    realme C75
    realme GT5 Pro
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    GT5 Pro
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    Vergleich öffnen
  • realme
    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
    realme C75
    agm Note N1
    agm
    Note N1
    8 GB · 6.52" · Unisoc Tiger T606
    Vergleich öffnen
  • realme
    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
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    coolpad C16
    coolpad
    C16
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  • realme
    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
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    N6000
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    8 GB · 6.72" · MediaTek Helio G92 MAX
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    CAT S75
    CAT
    S75
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    C75
    8 GB · 6.72" · MediaTek Helio G92 MAX
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    8 GB · 6.72" · MediaTek Helio G92 MAX
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