hotwav Cyber 15 vs Meizu 10

Übersicht

Marke: Hotwav; Meizu
Erscheinungsdatum: Mai 2024, vor 2 Jahren und 1 Monaten; Januar 2022, vor 4 Jahren und 5 Monaten
AnTuTu: 415.300 Antutu v10 Overall performance better than 68% of devices; 210.000 Antutu v8 Overall performance better than 55% of devices

Größe: 6.6"; 6.52"
Auflösung: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Typ: LCD IPS; LCD
Pixeldichte: 396 ppi High Density; 269 ppi Medium Density
Seitenverhältnis: 21:9; 20:9
Funktionen: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, Touch sampling rate 240 Hz, Brightnes 400 cd/m² (typ), DCI-P3, 100% NTSC, 10 Bits panel, Scratch resistant, Capacitive, Multi-touch, Frameless

Chipsatz: MediaTek Helio G99 (MT6789); Unisoc Tiger T618
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 6 x ARM Cortex A55 1.8Ghz + 2 x ARM Cortex A75 2.0Ghz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 6 nm; 12 nm
Taktfrequenz: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; GPU ARM Mali-G52-MP2
Arbeitsspeicher: 12 GB; 4 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 200 Mpx; 48 Mpx
Blende: ƒ/ 1.8; Unknow
Sensor: Samsung S5KHP3SP; —
Sensorgröße: 1/1.4"; —
Blitz: Dual LED; Dual LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; Yes, 120 fps
Funktionen: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Pixelgröße: —; 0.80 µm

Kapazität: 256 GB; 64 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Abmessungen: 82.3 mm 174.6 mm 12.8 mm Print 3D Model; 76.6 mm 164.5 mm 9.1 mm Print 3D Model
Gewicht: 290 g; 204 g
Materialien: TPU , Rugged Smartphone; Aluminium alloy
Farben: Black; Black White Green
Wasser-/Staubschutz: IP68, MIL-STD-810G , IP69; —
Sturzfestigkeit: Class A B C D E 270 drops without defects; —
Reparierbarkeit: Class A B C D E; —
Nutzbare Fläche: 67 %; 84 %

Betriebssystem: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake FlyMe 9 Lite (Android 11)
Google-Dienste: With Google Mobile Services; Without Google Mobile services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B3 (1800), B5 (850), B8 (900), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B3 (1800), B8 (900)