Honor X5 Plus vs hotwav T7S

Übersicht

Marke: Honor; Hotwav
Erscheinungsdatum: Oktober 2023, vor 2 Jahren und 8 Monaten; Januar 2025, vor 1 Jahren und 5 Monaten
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Größe: 6.56"; 6.52"
Auflösung: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 269 ppi Medium Density; 407 ppi Very high density
Seitenverhältnis: 20:9; 21:9
Funktionen: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Auflösung: 50 Mpx; 21 Mpx
Blende: ƒ/ 1.8; Unknow
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapazität: 5200 mAh; 6280 mAh
Typ: Li-Polymer; Li-Polymer
Schnellladung: Yes , 10.0W; Yes , 15.0W
Funktionen: Reverse charging, Non-removable; Reverse charging, Non-removable
Ladezyklen: —; 1100 cycles
Laufzeit: —; ~ 48h

Kapazität: 64 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Abmessungen: 75.1 mm 163.3 mm 8.4 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Gewicht: 188 g; 310 g
Materialien: Plastic; Rugged Smartphone, Plastic , Faux leather
Farben: Black Cyan Green; Black Green
Nutzbare Fläche: 84 %; 71 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)