hmd Pulse Pro vs hotwav T7S

Übersicht

Marke: HMD; Hotwav
Erscheinungsdatum: April 2024, vor 2 Jahren und 2 Monaten; Januar 2025, vor 1 Jahren und 5 Monaten
AnTuTu: 223.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Größe: 6.56"; 6.52"
Auflösung: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 265 ppi Medium Density; 407 ppi Very high density
Seitenverhältnis: 20:9; 21:9
Funktionen: Hole-punch Notch, Refresh rate 90 Hz, Brightnes 480 cd/m² (typ), Max brightness HBM - 600 cd/m², 70% NTSC, NTSC, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipsatz: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 12 nm; 12 nm
Taktfrequenz: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
Arbeitsspeicher: 6 GB; 4 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 13 Mpx; 21 Mpx
Blende: Unknow; Unknow
Blitz: Dual LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapazität: 128 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Abmessungen: 75.0 mm 163.2 mm 8.6 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Gewicht: 196 g; 310 g
Materialien: Plastic; Rugged Smartphone, Plastic , Faux leather
Farben: Black Purple Green; Black Green
Wasser-/Staubschutz: IP52; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Reparierbarkeit: Class A B C D E; Class A B C D E
Nutzbare Fläche: 84 %; 71 %

Betriebssystem: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Updates: OS updates: 5 years; —
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)