hmd Aura 2 vs hotwav T7S

Übersicht

Marke: HMD; Hotwav
Erscheinungsdatum: Februar 2025, vor 1 Jahren und 3 Monaten; Januar 2025, vor 1 Jahren und 4 Monaten
AnTuTu: 154.110 Antutu v10 Overall performance better than 54% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Größe: 6.52"; 6.52"
Auflösung: 576 x 1280 px LowRes; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 215 ppi Medium Density; 407 ppi Very high density
Seitenverhältnis: 20:9; 21:9
Funktionen: Water Drop Notch, Brightnes 460 cd/m² (typ), 72% NTSC, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipsatz: Spreadtrum Unisoc SC9863A; MediaTek MT8788V
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 28 nm; 12 nm
Taktfrequenz: 1.6 GHz; 2 GHz
GPU: PowerVR GE8322; Mali-G72 MP3
Arbeitsspeicher: 4 GB; 4 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 13 Mpx; 21 Mpx
Blende: Unknow; Unknow
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapazität: 256 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Abmessungen: 76.9 mm 166.4 mm 8.9 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Gewicht: 185 g; 310 g
Materialien: Plastic; Rugged Smartphone, Plastic , Faux leather
Farben: Black Green; Black Green
Wasser-/Staubschutz: IP54; IP68, IP69 , MIL-STD-810H
Nutzbare Fläche: 80 %; 71 %
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)