hisense A9 Pro vs iiif150 Raptor

Übersicht

Marke: HiSense; iiiF150
Erscheinungsdatum: März 2023, vor 3 Jahren und 2 Monaten; Juni 2023, vor 2 Jahren und 11 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 414.500 Antutu v10 Overall performance better than 68% of devices

Größe: 6.1"; 6.8"
Auflösung: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 395 ppi High Density
Seitenverhältnis: 18:9; 21:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, 560 cd/m² peak brightness, Corning Gorilla Glass, Capacitive, Multi-touch

Chipsatz: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 6 nm
Taktfrequenz: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
Arbeitsspeicher: 8 GB; 12 GB
64-Bit: Yes; Yes
RAM-Typ: —; LPDDR4X RAM

Auflösung: 13 Mpx; 108 Mpx
Blende: Unknow; ƒ/ 1.8
Blitz: LED; Dual LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision

Kapazität: 256 GB; 256 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.2

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.8 mm 176.4 mm 15.3 mm Print 3D Model
Gewicht: 183 g; 359 g
Materialien: Plastic; TPU , Rugged Smartphone
Farben: Black; Black Metallic Gold
Nutzbare Fläche: 76 %; 76 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)