hisense A9 Pro vs hotwav Note 16 Pro

Übersicht

Marke: HiSense; Hotwav
Erscheinungsdatum: März 2023, vor 3 Jahren und 3 Monaten; September 2025, vor 9 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Größe: 6.1"; 6.9"
Auflösung: 824 x 1648 px FHD; 720 x 1640 px HD+
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 260 ppi Medium Density
Seitenverhältnis: 18:9; 20:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 450 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch

Chipsatz: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 12 nm
Taktfrequenz: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
Arbeitsspeicher: 8 GB; 4 GB
64-Bit: Yes; Yes
RAM-Typ: —; LPDDR4X RAM

Auflösung: 13 Mpx; 13 Mpx
Blende: Unknow; ƒ/ 1.8
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapazität: 256 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 78.3 mm 171.8 mm 8.2 mm Print 3D Model
Gewicht: 183 g; 208 g
Materialien: Plastic; Plastic
Farben: Black; Black Pink Gray
Nutzbare Fläche: 76 %; 82 %
Sturzfestigkeit: —; Class A B C D E 52 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)