hisense A9 Pro vs hmd ARC

Übersicht

Marke: HiSense; HMD
Erscheinungsdatum: März 2023, vor 3 Jahren und 3 Monaten; Dezember 2024, vor 1 Jahren und 6 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Größe: 6.1"; 6.52"
Auflösung: 824 x 1648 px FHD; 576 x 1280 px LowRes
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 215 ppi Medium Density
Seitenverhältnis: 18:9; 20:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipsatz: Qualcomm Snapdragon 662; Spreadtrum Unisoc SC9863A
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 28 nm
Taktfrequenz: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8322
Arbeitsspeicher: 8 GB; 4 GB
64-Bit: Yes; Yes

Auflösung: 13 Mpx; 13 Mpx
Blende: Unknow; ƒ/ 2.0
Blitz: LED; Dual LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.9 mm 166.4 mm 9.0 mm Print 3D Model
Gewicht: 183 g; 185 g
Materialien: Plastic; Plastic
Farben: Black; Black
Nutzbare Fläche: 76 %; 80 %
Wasser-/Staubschutz: —; IP54
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google-Dienste: With Google Mobile Services; With Google Mobile Services
Updates: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)