Cubot KingKong Power vs hotwav Cyber 15

Übersicht

Marke: Cubot; Hotwav
Erscheinungsdatum: April 2023, vor 3 Jahren und 2 Monaten; Mai 2024, vor 2 Jahren und 1 Monaten
AnTuTu: 224.235 Antutu v9 Overall performance better than 56% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Größe: 6.58"; 6.6"
Auflösung: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 401 ppi Very high density; 396 ppi High Density
Seitenverhältnis: 20:9; 21:9
Funktionen: Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipsatz: MediaTek MT8788V; MediaTek Helio G99 (MT6789)
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 12 nm; 6 nm
Taktfrequenz: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; Mali-G57 MC2
Arbeitsspeicher: 8 GB; 12 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 48 Mpx; 200 Mpx
Blende: Unknow; ƒ/ 1.8
Pixelgröße: 0.80 µm; —
Blitz: LED; Dual LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KHP3SP
Sensorgröße: —; 1/1.4"

Kapazität: 256 GB; 256 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Abmessungen: 80.2 mm 169.9 mm 20.0 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Gewicht: 382 g; 290 g
Materialien: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Farben: Black; Black
Wasser-/Staubschutz: IP68, IP69; IP68, MIL-STD-810G , IP69
Nutzbare Fläche: 76 %; 67 %
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)