Cubot KingKong Power 3 vs hotwav W11

Übersicht

Marke: Cubot; Hotwav
Erscheinungsdatum: Oktober 2024, vor 1 Jahren und 7 Monaten; März 2024, vor 2 Jahren und 2 Monaten
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 260.000 Antutu v10 Overall performance better than 60% of devices

Größe: 6.72"; 6.6"
Auflösung: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 401 ppi Very high density; 407 ppi Very high density
Seitenverhältnis: 20:9; 20:9
Funktionen: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipsatz: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 6 nm; 12 nm
Taktfrequenz: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
Arbeitsspeicher: 6 GB; 6 GB
RAM-Typ: LPDDR4X RAM; LPDDR4X RAM
64-Bit: Yes; Yes

Auflösung: 100 Mpx; 64 Mpx
Blende: Unknow; ƒ/ 1.8
Pixelgröße: 0.80 µm; 0.80 µm
Blitz: LED; Dual LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX686 Exmor RS
Sensorgröße: —; 1/1.7"

Kapazität: 256 GB; 256 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.1

Abmessungen: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 84.8 mm 176.6 mm 26.5 mm Print 3D Model
Gewicht: 425 g; 563 g
Materialien: Rugged Smartphone, Metal; Rugged Smartphone, Polycarbonate
Farben: Black; Gray Orange
Wasser-/Staubschutz: IP68, IP69; IP68, MIL-STD-810G , IP69
Sturzfestigkeit: Class A B C D E 270 drops without defects; —
Reparierbarkeit: Class A B C D E; —
Nutzbare Fläche: 79 %; 70 %

Betriebssystem: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 4.2 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)