Cubot A1 vs hotwav T7S

Übersicht

Marke: Cubot; Hotwav
Erscheinungsdatum: April 2024, vor 2 Jahren und 2 Monaten; Januar 2025, vor 1 Jahren und 5 Monaten
AnTuTu: 115.000 Antutu v9 Overall performance better than 52% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Größe: 6.5"; 6.52"
Auflösung: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Pixeldichte: 270 ppi Medium Density; 407 ppi Very high density
Seitenverhältnis: 20:9; 21:9
Funktionen: Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipsatz: Spreadtrum Unisoc SC9863A; MediaTek MT8788V
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 28 nm; 12 nm
Taktfrequenz: 1.6 GHz; 2 GHz
GPU: PowerVR GE8322; Mali-G72 MP3
Arbeitsspeicher: 4 GB; 4 GB
64-Bit: Yes; Yes
RAM-Typ: —; LPDDR4X RAM

Auflösung: 13 Mpx; 21 Mpx
Blende: Unknow; Unknow
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapazität: 128 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Abmessungen: 75.5 mm 165.7 mm 10.5 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Gewicht: 205 g; 310 g
Materialien: Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Farben: Black Cyan; Black Green
Nutzbare Fläche: 81 %; 71 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google-Dienste: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.0 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)