coolpad COOL 20s vs hisense A9 Pro

coolpad COOL 20s
coolpad
COOL 20s
hisense A9 Pro
hisense
A9 Pro

Übersicht

Marke
Coolpad
HiSense
Erscheinungsdatum
Juni 2022, vor 3 Jahren und 11 Monaten
März 2023, vor 3 Jahren und 2 Monaten
AnTuTu
250.000 Antutu v8 Overall performance better than 59% of devices
102.000 Antutu v9 Overall performance better than 51% of devices

Display

Größe
6.58"
6.1"
Auflösung
1080 x 2408 px FHD+
824 x 1648 px FHD
Typ
LCD IPS
eInk E INK Carta 1200
Pixeldichte
401 ppi Very high density
302 ppi High Density
Seitenverhältnis
20:9
18:9
Funktionen
Water Drop Notch, Refresh rate 90 Hz, DCI-P3, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch, Frameless
Water Drop Notch, Capacitive, Multi-touch, Frameless

Leistung

Chipsatz
MediaTek Dimensity 700 (MT6833)
Qualcomm Snapdragon 662
CPU
4x Cortex A76 2.2 GHz + 4x Cortex A55 2.0 GHz
4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
CPU-Typ
Octa-Core
Octa-Core
Fertigung
7 nm
11 nm
Taktfrequenz
2.2 GHz
2 GHz
GPU
Arm Mali-G57 MC2
Qualcomm Adreno 610
Arbeitsspeicher
4 GB
8 GB
RAM-Typ
LPDDR4X RAM
64-Bit
Yes
Yes

Hauptkamera

Auflösung
50 Mpx
13 Mpx
Blende
ƒ/ 1.8
Unknow
Blitz
LED
LED
Optische Stabilisierung
No
No
Zeitlupe
No, 30 fps
No, 30 fps
Funktionen
4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Continuous autofocus, Manual focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode
Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Frontkamera

Auflösung
8 Mpx
5 Mpx
Blende
Unknow
ƒ/ 2.0

Akku

Kapazität
4500 mAh
4000 mAh
Typ
Li-Polymer
Li-Ion
Schnellladung
Yes , 18.0W
No
Funktionen
Non-removable
Non-removable

Speicher

Kapazität
128 GB
256 GB
Typ
UFS Storage 2.1
SD-Slot
No
Yes , Slot for SD or second SIM card

Gehäuse

Abmessungen
74.7 mm 163.0 mm 8.3 mm Print 3D Model
79.5 mm 159.0 mm 7.8 mm Print 3D Model
Gewicht
180 g
183 g
Materialien
Polycarbonate
Plastic
Farben
Black White Cyan
Black
Nutzbare Fläche
85 %
76 %

Software

Betriebssystem
Android 11 Red Velvet Cake Android 11
Android 12 Snow Cone Android 12
Google-Dienste
Without Google Mobile services
With Google Mobile Services

Konnektivität

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.1 LELow energy consumption
Bluetooth 5.1
Bluetooth-Profile
A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot
USB
USB Type-C
USB Type-C
USB-Funktionen
Charging, OTG
Charging, OTG
Navigation
GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo
GPS, A-GPS

Netzwerke

5G
n1 (2100), n28a (700), n41 (2500), n77 (3700), n78 (3500)
4G LTE
B1 (2100), B3 (1800), B5 (850), B8 (900), B34 (TDD 2100), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B2 (1900), B5 (850), B8 (900)
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B8 (900)
B2 (1900), B3 (1800), B5 (850), B8 (900)

Sensoren & Sicherheit

Fingerabdruck
Yes, on the side
Yes, on the side
Beschleunigungssensor
Yes
Yes
Näherungssensor
Yes
Yes
Lichtsensor
Yes
Yes
Kompass
Yes
Kühlsystem
Yes
No
Audio
Stereo Speakers, 2 microphones
Stereo Speakers

Verglichen mit coolpad COOL 20s

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    4 GB · 6.58" · MediaTek Dimensity 700 (MT6833)
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Verglichen mit hisense A9 Pro

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